Silicon Photonics (CPO) Penetration Acceleration Curve in AI Cluster Optical Interconnects
As AI clusters scale to tens of thousands of accelerators and beyond, the limitations of traditional electrical interconnects become increasingly apparent. Bandwidth demands, reach requirements, and power constraints push data center architects to seek new ways to move bits efficiently between nodes. Silicon photonics, and in particular co‑packaged optics (CPO), has emerged as a critical technology for addressing these challenges.